Stadnik, Snezhana
Associate

Snezhana Stadnik Tapia

  • Commercial Litigation and Disputes
  • Global Arbitration, Trade and Advocacy
  • Privacy and Cybersecurity

  • New York

  • New York University School of Law, J.D., 2018
  • University of Washington, B.A., 2011 (cum laude)
  • University of Washington, B.B.A., 2011 (cum laude)
Locations